FEM Functional Film ─ EMI Shield Film ─ EMI Absorber Film ─ Conductive Bonding Film ─ Thermal Film Conductive Paste ─ TSP ─ Matal Mesh EAM ─ Optically Clear Resin ─ UV Pattern Adhesive Home > R&D > FEM > Conductive Paste > TSP   Description - KICP-100T is a Ag Paste which is designed by conductive adhesive blending and dispersion tech . It features remarkable conductivity and excellent adhesion on ITO coatd substrate   Data Sheet Test Items KICP-100T KICP-100M Paste Viscosity (cps, at 5rpm 150,000 20,000 Metal Content >70% >70% Film Line Width 80~100um 2mm Volume Resistance(Ω·㎝) 5.0 x 10-5 5.0 x 10-5 Adhesion Good Good Chemical Resistance Good Good

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